IC Sockets & Adapters: Grypper®

Net zero package footprint engineering test socket for fine pitch BGA devices at ~0.35mm pitch. The PCB footprint of the Grypper is identical to the IC package, which means only one PCB design is required across test, validation, and production.

The G35 Grypper uses a contact design with oxide-cutting wipe action. The contact wipes the side of the solder ball during insertion, breaking through solder oxides for a reliable electrical connection. No lid is required; the package snaps directly into the socket, keeping the topside of the device accessible for probing, scoping, and troubleshooting.

A short signal path achieves low inductance and low insertion loss, providing a nearly invisible electrical connection. The unique contact design reduces insertion force required to safely retain fine pitch, lower ball count packages within the socket.