ASP
- Package Types BGA, LGA, QFN, DFN, Leaded
- Pitch Range 0.35mm+
- Contact Industry Standard Spring Pins
- Configuration Standardised Stepped Footprint
- Lid Options Swivel, Spring-Loaded Clamshell, ½-Turn
- Custom Design Available on Short Lead Times
High-performance sockets in standardised stepped footprint configurations, incorporating industry-standard spring pins. Designed for any IC package type where minimal board space and fast, easy testing are the priority.
Aspen sockets use a stepped footprint with industry-standard high-performance spring pins for BGA, LGA, QFN, DFN, and leaded packages, with Ironwood sourcing pins from multiple manufacturers for flexibility across geometry, force, plating, and material. Three lid types are available: Swivel for standard use, Spring-Loaded Clamshell for quick chip replacement, and ½-Turn for larger I/O devices.
Overview
Aspen sockets fill the gap between Ironwood’s elastomer and full custom socket lines, standardised footprint configurations with industry-standard spring pins, configurable for almost any IC package type and application requirement from 0.35mm pitch. Contact elements are selected per application, and sockets mount by hardware as standard.
Specifications
- Contact sourcing: Multiple pin manufacturers supported; contact element selected per application requirement
- Mounting: Hardware mount (standard)
- Compliance: ISO 9001, RoHS
FAQs
What are the delivery timelines?
- Standard sockets: 3–4 weeks. Custom sockets: 6–8 weeks.
What is the process for a custom socket design?
- Share your requirements; we quote the engineering fee, socket cost and lead time. After the purchase order, design takes 1–2 weeks for your approval, then manufacturing and shipping take 4–6 weeks.
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