SG / CG
- Package Types BGA, QFN, MLF
- Pitch Range 0.3mm – 1.27mm
- Bandwidth >40 GHz
- Temperature Range -35°C to +125°C
- Self Inductance 0.06 nH
- Contact Resistance <0.05 Ω
Embedded wire elastomer contact technology providing excellent signal integrity in a cost-effective ZIF socket, designed for prototyping and test applications across BGA and QFN/MLF devices from 0.3mm pitch.
Gold-plated brass filaments suspended in silicone rubber contact IC solder balls and PCB pads from both sides at <0.05Ω, 0.06 nH, and 2A per pin, in a footprint 2.5mm per side larger than the IC. An aluminium heat sink screw compresses the stack for up to 100W dissipation; the socket matches SBT-BGA spring pin footprints, with epoxy mounting and custom builds down to 0.3mm pitch on short lead times.
Overview
SG/CG sockets are Ironwood’s embedded wire elastomer solution — cost-effective, excellent signal integrity, and compatible with a wide range of BGA and QFN/MLF device sizes. Cross references available for Xilinx, Intel, and Microchip packages. Available with hardware, epoxy, or SMT mounting and a swivel lid.
Specifications
- Current capacity: 2A per contact
- Footprint addition: 2.5mm per side over IC package
- IC body size support: 1mm to 55mm (larger sizes may need backing plate)
- Mounting: Hardware mount, epoxy mount, SMT option
- Lid options: Swivel lid
- Compliance: ISO 9001, RoHS
FAQs
What are the delivery timelines?
- Standard sockets: 3–4 weeks. Custom sockets: 6–8 weeks.
Can we speak directly with the Ironwood team?
- For most queries, we handle this through Globetek in consultation with Ironwood. For complex custom design work, we arrange a direct call with Ironwood's engineers.
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