G40 Grypper
- Package Types BGA, QFN, LGA
- Footprint Net Zero (identical to package)
- Lid Not required
- Solder Balls Pre-reflowed on contacts
- Signal Path Short — low inductance, low insertion loss
Net zero package footprint engineering test socket for standard pitch BGA devices. Pre-reflowed solder balls on the G40 contacts ensure reliable solder volume at the PCB-to-socket interface.
The G40 builds on the G35 with solder balls reflowed onto the contacts, ensuring reliable solder volume at the PCB-to-socket interface for improved consistency in production and validation environments. The same oxide-cutting wipe action breaks through solder oxides during insertion for a reliable electrical connection every time.
No lid required as the package snaps directly, keeping full topside access for probing and scoping. Low insertion force protects packages during insertion. Net zero footprint means one PCB design across test, validation, and production, thereby reducing overall cost of test.
Overview
The G40 is the standard pitch Grypper with pre-reflowed solder balls for consistent solder volume at the PCB interface. The preferred choice for production and validation environments at standard BGA pitches. It attaches by surface mount reflow, and custom sizes are available on request.
Specifications:
- Contact action: Oxide-cutting wipe action
- Topside access: Full — for probing and scoping
- Mounting: Surface mount reflow attachment
- Custom sizes: Available on request
- Compliance: ISO 9001, RoHS
FAQs
What are the delivery timelines?
- Standard sockets: 3–4 weeks. Custom sockets: 6–8 weeks.
Can sockets be sized to our board design?
- Yes. Share your mechanical specifications and application requirements, and we'll provide a quote with lead time.
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