Globetek takes pride in being the exclusive distributor of Grypper sockets, the revolutionary solution for zero-footprint, high-performance testing of microelectronic components. These sockets provide a unique and innovative way to test small-sized components, offering excellent performance while consuming very little board space. Grypper sockets are available for an extensive range of applications, including CSP, BGA, QFN, DFN, QFP, SOIC, and other packages.
The GHz line of sockets with 6 different contact technologies supports up to 110 GHz bandwidth, >=0.2mm pitch, <=10000 pins, 500K insertions and the smallest footprint in the industry.
The Grypper sockets have a unique design that provides a secure and reliable connection with the device under test while consuming minimal board space. These sockets are designed for high-frequency and high-speed applications, and the materials used in the sockets ensure excellent electrical performance with minimal signal distortion. They are also equipped with a number of features that make them easy to use, including auto alignment, low insertion force, and a simple actuation mechanism.
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At Globetek, we recognize the importance of high-quality testing solutions for microelectronic components, and the Grypper sockets are an excellent addition to our range of offerings. These sockets are perfect for applications in the aerospace, defense, medical, and industrial sectors, where reliable and high-performance testing solutions are critical. The Grypper sockets are an excellent choice for engineers and manufacturers who require a reliable and easy-to-use solution for testing small-sized components.
Grypper (Zero Footprint)
Grypper G35 / G40
High-performance, 0.35mm-0.5mm pitch net zero package footprint engineering test sockets for BGA style packaged devices.
Grypper
High-performance, 0.65 mm + pitch net zero package footprint engineering test sockets for BGA style packaged devices.
Grypper G80 / G80 LIF
High-performance, 0.65 mm+ pitch net zero package footprint engineering test sockets for BGA style packaged devices over 200 ball count and for over 300 the G80 LIF to reduce insertion forces.
Surface Mount Sockets (Near Zero Footprint)
Near Zero Footprint SMT Spring Pin Sockets
High performance, higher insertion count – with sliding lid and other options, surface mountable near zero footprint sockets for 0.35mm+ pitch devices (BGA, LGA, QFN, etc.).
Grypper "Y"
High performance, medium insertion count – with sliding lid, surface mountable near zero footprint sockets for 0.35mm+ pitch BGA devices.
Standard Memory Grypper Sockets
DDR
Zero Footprint – No Lid Required – S21 Electrical Performance >40 GHz.
eMMC
Zero Footprint – No Lid Required – S21 Electrical Performance >40 GHz.
LPDDR
Zero Footprint – No Lid Required – S21 Electrical Performance >40 GHz.
ONFi
NAND/ONFi Zero Footprint – No Lid Required – S21 Electrical Performance >40 GHz.
