Temperature Forcing Systems
Creating an environment where you can control the temperature, pressure, as well as humidity of the air, is critical in most experiments. Special devices like the ones from Temptronic’s can help you create a controlled environment for your lab work easily. Globetek is the proud distributor of Temptronic’s ThermoStream products that help you control the environment of a closed chamber.
Temptronic’s devices are highly portable and can help you generate fresh, clean as well as dry air for testing purposes. The air from these devices can be used for temperature testing as well as conditioning of electronic items like ICs, MEMS, transceivers, etc. With precise control modules, you can easily control the temperature of the closed chambers with exceptional precision levels.
For the last three decades Globetek has been providing state-of-the-art temperature forcing and test systems for semiconductor characterization by partnering with the global leader Intest Thermal Solutions of USA.
Intest Thermal’s Temptronic ThermoStreams are portable systems that deliver clean dry air for precision temperature testing or conditioning of electronics (ICs, MEMS, transceivers, or circuits) and materials. No other systems can bring your test subjects to temperature faster with precise control.
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With rapid thermal cycling or long saturation at a precise temperature, these systems optimize throughput for characterization, verification, thermal shock or failure analysis applications – at the test bench or on the production floor.
Eco-Friendly Temperature Test System
The ECO 710 is an environmentally friendly Temptronic® ThermoStream® temperature forcing system that uses less energy with ECO series thermal test system very low audible noise with a temperature range of -80 to +225°C.
Temptronic ThermoStream Product Portfolio
500 & 600 Series Mobile Temperature Environments
 |  |  |  | ||
| Model | ATS-505, 605 | ATS-515, 615 | ATS-525, 625 | ATS-535, 635 | ATS-545, 645 |
|---|---|---|---|---|---|
| Ln2 or LCO2 not required | ✓ | ✓ | ✓ | ✓ | ✓ |
| Temperature Range (at thermal head) | -20 to +225°C | -45 to +225°C | -60 to +225°C | -80 to +225°C | |
| System Airflow Output | 4 to 10 scfm (1.9 to 4.7 l/s) | 4 to 10 scfm (1.9 to 4.7 l/s) | 5 scfm (2.4 l/s) Fixed Flow | 5 scfm (2.4 l/s) Fixed Flow | 4 to 18 scfm (1.8 to 8.5 l/s) Continuous |
| Transition Rates | 0 to +125°C, <3 min +125 to 0°C, <4 min | -40 to +125°C, <12 sec +125 to -40°C, <40 sec | -40 to +125°C, <12 sec +125 to -40°C, <40 sec | -40 to +125°C, <12 sec +125 to -40°C, <40 sec | -55 to +125°C, <10 sec +125 to -55°C, <10 sec |
| Temperature Display & Resolution | ±1°C | ±1°C | ±1°C | ±1°C | ±1°C |
| Temperature Accuracy | ±1°C | ±1°C | ±1°C | ±1°C | ±1°C |
| Directly Control Device Under Test (DUT) | ✓ | ✓ | ✓ | ✓ | ✓ |
| DUT Control Sensors | Type T or K Thermocouples | Type T or K Thermocouples | Type T or K Thermocouples | Type T or K Thermocouples | Type T or K Thermocouples |
| Remote interface | IEEE.488, RS232 | IEEE.488, RS232 | IEEE.488, RS232 | IEEE.488, RS232 | IEEE.488, RS232 |
| Thermal Cap with protection from condensation at DUT site | ✓ | ✓ | ✓ | ✓ | ✓ |
| Compact, portable system | Fits bench top | Easily integrates to bench top | Easily integrates to bench top | LabView™ drivers | LabView™ drivers |
| CE Compliant and CFC-free | ✓ | ✓ | ✓ | ✓ | ✓ |
| Facility requirements | CDA at 90 psi minimum; Various power requirements available 130-240 VAC, 50/60Hz | Built-in compressor; No facility air needed | Same as ATS-505 to 625 | ||
700 & 800 Series Mobile Temperature Environments
 |  |  |  | |
| Model | ATS-710, 810 | ATS-730, 830 | ATS-750, 850 | ATS-770, 870 |
|---|---|---|---|---|
| Ln2 or LCO2 not required | ✓ | ✓ | ✓ | ✓ |
| Temperature Range (at thermal head) | -80 to +225°C | -90 to +225°C | -90 to +300°C | -100 to +225°C |
| System Airflow Output | 4 to 18 scfm (1.8 to 8.5 l/s) Continuous | 4 to 18 scfm (1.8 to 8.5 l/s) Continuous | 4 to 18 scfm (1.8 to 8.5 l/s) Continuous | 4 to 12 scfm (1.8 to 5.6 l/s) Continuous |
| Transition Rates | -55 to +125°C, <10 sec +125 to -55°C, <10 sec | -55 to +125°C, <10 sec +125 to -55°C, <10 sec | -40 to +125°C, <12 sec +125 to -40°C, <40 sec | -55 to +125°C, <10 sec +125 to -55°C, <10 sec |
| Temperature Display & Resolution | ±1°C | ±1°C | ±1°C | ±1°C |
| Temperature Accuracy | ±1°C | ±1°C | ±1°C | ±1°C |
| Directly Control Device Under Test (DUT) | ✓ | ✓ | ✓ | ✓ |
| DUT Control Sensors | Type T or K Thermocouples, RTD (100 Ohm) | Type T or K Thermocouples | Type T or K Thermocouples | Type T or K Thermocouples, RTD (100 Ohm) |
| Remote interface | IEEE.488, RS232 | IEEE.488, RS232 | IEEE.488, RS232 | IEEE.488, RS232 |
| Thermal Cap with protection from condensation at DUT site | ✓ | ✓ | ✓ | ✓ |
| LabView™ drivers | ✓ | ✓ | ✓ | ✓ |
| CE Compliant and CFC-free | ✓ | ✓ | ✓ | ✓ |
| Heated Defrost | ✓ | — | ✓ | ✓ |
| Reduced Power Mode - heat only when using cold temperatures | ✓ | — | ✓ | ✓ |
| Automatic Power Reduction - reduce power usage during idle time | ✓ | — | ✓ | ✓ |
| Mechanical Arm or Turret Configuration | ✓ | ✓ | ✓ | ✓ |
| Optional Extended Height & Reach configuration for Mechanical Arm | ✓ | ✓ | ✓ | ✓ |
| Thermal Cap size options & Flexhose to connect external thermal chamber or test enclosure | ✓ | ✓ | ✓ | ✓ |
| Facility requirements | CDA at 90 psi minimum; Various power requirements available 130-240 VAC, 50/60Hz | |||